Unleashing system efficiency and performance
with Industry’s newest voltage node

Infineon introduces the first 15 V trench power MOSFETs in the industry, utilizing the brand-new OptiMOS™ 7 technology. This system- and application-optimized technology, targets DC-DC conversion with low output voltages in server and computing applications. Compared to OptiMOS™ 5 25 V, a lower breakdown voltage leads to a significant reduction in R_DS(on) and FOMQ_g/FOMQ_OSS. The best-in-class product portfolio comprises PQFN 3.3x3.3 Source-Down packages with bottom- and dual-side cooling variants in Standard- and Center-Gate footprints for flexible and optimal PCB design and a PQFN 2x2 package with a reinforced clip.

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The industry’s first
15 V trench power MOSFETs

Unlock the power of CoolGaN™ Bi-directional Switches!

This innovative technology is revolutionizing multiple applications, from replacing back-to-back discrete switches in Vienna rectifiers, HERIC, and T-type converters to enabling single-stage DC-AC conversion in solar micro-inverters. The DEMO_AC_ZVS_HVBDS demonstration board showcases the AC soft switching capability of the BDS in 50/60 Hz AC grid conditions, with symmetrical Triangular Current Mode (TCM) operations and a load-less setup for flexible testing in a range of voltage, current, and switching frequency conditions, all under a simple open loop control.

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AC ZVS Operation HV BDS Demo Board

Key trade-offs when designing a server power supply

In this episode of our 'We Power AI' podcast series, Principal Engineer Roberto Rizzolatti shares his expert insights on 48V topologies and applications. Learn when to use unregulated topologies over regulated ones and how to boost server efficiency with 48V power distribution solutions. Discover the benefits and applications of unregulated and regulated topologies in server power supplies. Watch to optimize your data center design and learn more about 48V power architecture!

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Enhancing efficiency with 48V solutions:
topologies, benefits and applications

CoolSiC^TM MOSFETs Generation 2

Power conversion solutions that guarantee high energy efficiency are key to reaching decarbonization goals and achieving unlimited green energy. SiC based power electronics boost energy efficiency compared to Si alternatives in many cases. To speed up the implementation of clean energy and energy efficiency in a global world Infineon is releasing the second generation of CoolSiC^TM MOSFETs.

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Empowering the next generation of high-performance systems

CoolMOS^TM S7T with integrated temperature sensor

The CoolMOS^TM S7T product family is a new variant of the CoolMOS^TM S7, introduced to address the solid-state solutions, especially the solid-state relay (SSR) application. It has an integrated temperature sensor to improve the accuracy of junction temperature sensing. The integration of these features has a positive impact on the durability, safety, and efficiency of many electronic applications. For SSR, it means enhanced performance and reliability due to the highly accurate, embedded sensor and its superior RDS(on).

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A family of superjunction MOSFETs for SSR applications

NEW! OptiMOS^TM 6 200 V family of MOSFETs

Introducing the new OptiMOS^TM 6 200 V family of MOSFETs which utilizes the latest trench MOSFET technology with a revolutionary cell design. OptiMOS^TM 6 200 V offers the benefits of exceptionally low on-state resistance, superior switching performance and robustness for improved EMI behavior and lower switching losses as well as improvements in parameters relevant for MOSFET paralleling.

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The latest trench MOSFET technology

EZ-PD™ PAG2 Secondary Side ZVS Controller

The market for high-power-density USB PD chargers and adapters is ever-increasing. To answer this demand, the EZ-PD™ PAG2 secondary-side controlled flyback converter provides integrated PWM, SR, and PD capabilities. Learn about the versatility of the EZ-PD^TM PAG2 controller and the benefits of secondary side control in implementing efficient and reliable USB PD power adapter and wall outlet designs.

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Introducing the EZ-PD^TM PAG2 power adapter and wall outlet solution

Small-signal MOSFETs and their applications

This 18-minute video will help you to:

• Understand the key characteristics and parameters of small-signal MOSFETs.
• Gain an overview of Infineon’s full product portfolio including n-channel, p-channel and depletion-mode products.
• Understand the most common applications including battery protection and charging, load switches, DC-DC converters and level shifters.

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Introduction to small-signal MOSFETs

Powering energy independence

As the market leader in power electronics, Infineon helps you to bring energy-efficient DC fast charging designs to life. Benefit from one of the most comprehensive, ready-to-implement one-stop product and design portfolios on the market that covers the entire product range from power conversion, microcontrollers, security, auxiliary power supply, and communication.

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High-power solutions for fast EV charging

NFC tag-side controller for smart sensing applications

The NGC1081 is a microcontroller with integrated NFC connectivity, sensing capabilities, and energy harvesting functions. It allows for the development of miniaturized smart devices that can be controlled and powered by a personal mobile phone. Take this course to learn about this NGC1081’s key features, benefit and applications.

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The reliable solution for battery-free IoT devices

Low-voltage-drives scalable-power demoboard platform

Enabling rapid prototyping, Infineon’s board is an easy-to-use test setup for proof of concept designs and investigation of MOSFET technologies from single half-bridge to three-phase inverter setups.

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Modular concept for high-power drive-application test setup

Replace any legacy barrel connector with EZ-PD^TM BCR

Moving to USB-C had never been so easy thanks to EZ-PD™ Barrel Connector Replacement (BCR) family of charging port controllers. In this video series, you will learn how to apply our EZ-PD™ BCR to replace any end application with a barrel connector input with USB-C. In addition, you will also discover how flexible and customizable our EZ-PD BCR products are by seeing the two software tools, EZ-PD Configuration Utility and EZ-PD HPI Utility, in action with the CY4534 evaluation kit as hardware platform.

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Tutorial Series: The simplest way to move to USB-C

Digital Controllers, Integrated Power Stages And High Efficiency POLs

High-performance power semiconductors are key to reliable and green data centers. They enable high PUE and DCIE. Infineon offers market leading DC/DC converter solutions that support quick design-in options and provide power density and robustness.

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Market Leading Power Components Address Data Center Trends

OptiMOS^TM 6 100 V

This OptiMOS^TM 6 100 V power MOSFET webinar discusses how it is setting the new industry standard. It provides an overview of the improved performances and the use-case applications that can benefit from this technology such as telecom, solar, and battery powered applications. Watch now and learn how your applications can benefit from this technology.

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Breakthrough device pushes performance to the next level

Power and sensing Selection guide 2022

Eliminate choice overload with our power and sensing selection guide which arranges our broad, cutting-edge portfolio and game-changing solutions around applications and technologies in a synthesized and easy-to-digest format to save time for you finding the products that elevate your design to the next level.

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The ultimate guide to Infineon's power and sensor offering

OptiMOS^TM 6 100 V MOSFET Technology

Infineon introduces OptiMOS^TM 6 100 V, the new performance MOSFET that enables lower conduction losses and increased power density for the highest performance in the application, meeting contemporary application requirements.

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Bring your high switching frequency application to the next level

CoolGaN^TM Integrated Power Stage (IPS) 600V

Infineon’s CoolGaN IPS leverages the market’s most reliable GaN and driver technology, uniting ultimate efficiency and reliability with ease-of-use. The CoolGaN IPS provides higher switching frequency and efficiency in a smaller, lighter design, enabling manufacturers to move from 25W/in² to 30W/in².

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Breakthrough technology for high-density chargers and adapters

Three Different Power Packages

Take a closer look at the OptiMOS^TM power MOSFETs in TOLL, TOLG, and TOLT packages. The three different packages of TOLL (TO-Leadless), TOLG (TO-Leaded with gullwing), and TOLT (TO-Leaded top-side cooling) address different requirements. They are optimized for high power, better thermal cycling on board robustness and superior thermal performance, respectively.

TOLx package family

USB-C fast charging solutions tailored to your needs

Take a closer look at Infineon’s fast-charging, lightweight, low carbon footprint solution. Infineon helps engineers to keep up with the latest charging trends by providing full system solutions and the needed design support to develop high-performing, highly reliable charging solutions at competitive cost that compete in the market!

USB-C fast charging solutions tailored to your needs

New gate driver ICs for 5G and LTE macro base stations

Take a closer look at Infineon’s EiceDRIVER^TM 2EDL8 family of dual-channel junction-isolated gate driver ICs. Designed for medium-voltage power MOSFETs in half-bridge applications such as telecom and datacom DC-DC converters, the 2EDL8 family comprises four variants offering two different pull-up currents and two different input configurations.

Dual-channel junction-isolated EiceDRIVER^TM 2EDL8 gate driver  

XDP^TM digital power control | #XDPP1100

Learn more about the new XDPP1100, a highly-integrated and fully programmable controller offering optimized solutions for 48 V isolated DC-DC power converters that require system-level communication such as PMBus. With its unique architecture, this device is destined to solve any modern power system challenge by enabling a great degree of design flexibility and reduced firmware development efforts to support faster time-to-market.

• Innovative design is comprised of high-performance analog front-end which has dedicated voltage and current sense ADCs.
• Fast state machine based configurable digital control loop which includes power processing blocks for various DC/DC topologies.
• ARM^® Cortex^TM-M0 100MHz microcontroller subsystem that can be used for enhanced control, housekeeping functions, interfacing and firmware-based customization.
• For advanced power management features, such as sequencing, fault management, telemetry, real-time monitoring, optimization and communication with the system, the XDPP1100 also includes PMBus^®.
• 24-pin 4mm x 4mm VQFN package is smallest and most compact digital power controller in the industry. 40-pin VQFN package also available.

XDP digital power control

MERUS^TM MA12070 based musical instrument bass amplifier board

Take a closer look at this hands-on sound demonstration. The MA12070 modeled after classic vacuum-tube bass amplifier topology. It utilizes the exceptional audio quality and best-in-class efficiency of Infineon’s MERUS amplifier technology.

• The 12AU7 based pre-amplifier stage provides the warmth and natural overdrive capability of a triode vacuum tube.
• The MERUS MA12070 multilevel class D amplifier efficiently creates the required output level without missing a beat.

MERUS MA12070

OptiMOS^TM Source-Down PQFN 3.3x3.3

Take a closer look at Infineon's OptiMOS^TM Source-Down PQFN 3.3x3.3. Why does it matter to solve the power density challenge? The source-down breakthrough allows better performance than today's industry benchmarks.

• Able to improve R_DS(on) by up to 30%, depending on the voltage class.
• Better thermal management: 20% reduced R_thJC
• Addressing applications in drives, telecom, SMPS and server.
• Because the die is flipped inside the package, a larger die inside of the package is possible.
• Benefits inside the package help reduce parasitics for the product.
• Changing parts in existing designs is easy. A small change in layout is required to optimize source-down in the application to have the maximum performance gain.

OptiMOS^TM Source-Down PQFN 3.3x3.3

650V CoolSiC^TM MOSFETs

Take a closer look at Infineon's 650V CoolSiC^TM MOSFETs. Infineon leads in all power technologies. Dr. Steffen Metzger explains the technical details of the CoolSiC MOSFET in 650V, and highlights the benefits they bring for specific applications. Additionally, he compares the 650 V CoolSiC MOSFET with GoolGaN^TM and CoolMOS^TM and their respective positioning within the greater realm of power semiconductors.

• Higher voltage operation means: extended power density, higher frequency switching, thinner active layers, improved heat dissipation and higher efficiency.
• Addressing applications such as: Datacenter and telecom SMPS, Industrial SMPS, solar inverters, energy storage, UPS, battery formation, EV charging, motor drives plus automotive applications like OBC (on-board charger)
• High performance combined with robustness and ease of use.
• High reliability especially with high temperature and in harsh environments.
• Highest power handling capability through lower R_DS(on).
• More safety margin against overshoots.
• Smaller system size.

650V CoolSiC^TM MOSFETs

650V CoolMOS^TM SJ Power MOSFET CFD7A

Take the online course to learn more about the 2020 CoolMOS SJ MOSFET family member: the CFD7A!

Get on the fast lane in automotive applications. Enjoy short videos and interactive learning elements at your own pace and have fun with repetition tasks in between! Course attendees will learn about topics including:

• CoolMOS CFD7A focus applications
• CFD7A beyond AEC-Q101
• Key benefits of high reliability, high efficiency & faster switching
• xEV optimization
• Scalability

650V CoolMOS SJ Power MOSFET CFD7A

Quality and cost-effectiveness all in one: BCR linear LED driver IC family

Watch the expert to learn more about the BCRxx LED driver IC family.

This video highlights the well-established and latest additions of cost-effective and reliable ICs for long-life LED systems. The BCR family is well-established with over 1 billion pieces sold. The smallest and most cost-efficient product family of linear LED driver ICs for general lighting applications. BCR linear LED driver ICs are able to drive current up to 250mA making them the ideal choice for low- to mid-power LEDs.

• Typical applications for linear current controlled LED drivers are: LED strips, LED signage, automotive interior lighting, emergency lighting, multi-channel/multi-color architectural lighting, shop lighting and retail equipment such as refrigerators, vending machines.
• Few components are necessary making LEDs ideally-suited for limited-space applications.
• While resistor lighting is simple, LED lighting offers significant reliability, robustness and quality advantages resulting in smooth-running, low-maintenance systems.
• Superior homogeneous light output from beginning to end of strip despite the LED forward voltage and voltage drop at the IC.
• Ultra-low voltage drop at IC offers more flexibility in design and cost savings, ideally suited for cases where some voltage headroom is required.

Linear LED Driver IC BCR43xx

Size matters! Single-channel non-isolated gate-driver IC with TDI in ultrasmall TSNP package

Watch the expert to learn more about the 1EDN7550U non-isolated gate-driver IC.

This video highlights the 1EDN7550U, a non-isolated gate-driver IC available in an ultrasmall TSNP package. Each time a power MOSFET is turned on or turned off, the SMPS parasitic inductances produce ground-shift which can cause false triggering of the gate-driver ICs. Infineon's cost-effective and small gate-driver IC family protects against such consequences.

• The ultra-small 1.5mm x 1.1mm 6-pin leadless TSNP package variant occupies a PCB area 5 times smaller than that of the SOT23 series.
• Can resolve static ground-shifts up to +/- 70V and transient ground-shifts up to +/- 150V with a 3.3V PWM signal input.
• The small size and ground-shift robustness enables operation of two gate-driver ICs in a half-bridge configuration.
• Best-in-class, robust and reliable low-side gate-driver IC with truly differential inputs.
• High power density, high efficiency and lower cost than alternative solutions.

1EDN7550U Non-Isolated Gate-Driver IC

Expert talk on the 600 V CoolMOS^TM PFD7

Watch the expert to learn more about the 600 V CoolMOS PFD7.

This video highlights the super-junction MOSFET with a fast-body diode targeting high-density charger and adapter applications and low-power drives which are typically deployed in home appliances.

• Supports key trend of small & light mobile products.
• Enables high efficiency for high power chargers and adapters.
• Pushes the limits of affordable ultra-high power density.
• Support major trend of energy saving at major home appliances with speed-controlled motors.
• Optimized for high efficiency especially at light-load conditions (e.g. <300 W).
• Reduction of both bill-of-material and operating costs.
• New innovative packages: ThinPAK 5x6 and SOT-223.

600 V CoolMOS^TM PFD7

Expert talk on the groundbreaking OptiMOS^TM Source-Down package concept

Watch the experts to learn more about the groundbreaking OptiMOS Source-Down package concept.

Infineon, the industry leader in power systems again made a step forward in innovation for its customers’ even greater convenience. Listen to our experts discussing how our system-level understanding and innovative spirit helps us to supply the market with the right components.

• Description of Source-Down packaging MOSFET platform. Changing the industry standard for power MOSFETs.
• Increased silicon/package ratio and reduction in R_DS(on), leading to increase in system efficiency.
• Thermal enhancement via big cooling area (thermal pad on source potential).
• Higher performance via latest OptiMOS technology.
• Increased power density.
• Sophisticated power management solutions leading to smaller, greener products.

OptiMOS^TM Source-Down package

Infineon’s CoolSiC^TM MOSFET 650 V

Watch the CoolSiC MOSFET 650 V video to learn more about the benefits CoolSiC can bring to your designs!

CoolSiC sets an industry technology benchmark by combining high performance with robustness and ease-of-use. It enables reliability gains, especially with high temperatures and in harsh environments.

• 650V Trench Power MOSFET.
• Si - GaN - SiC positioning.
• Si, SiC, and GaN Value proposition.
• CoolSiC and CoolMOS naming nomenclature.
• CoolSiC and CoolMOS technology differences.
• Benchmarks in target applications.
• Portfolio and target applications.

Infineon’s CoolSiC^TM MOSFET 650 V

Infineon’s IRS2452A Class D Amplifier Control IC

IRS2452A Class D Amplifier Application Note

A functional description and design guide for the IRS2452AM Class D amplifier control IC.

• The IRS2452AM is a two channel Class D audio amplifier driver rated at 400 V with integrated PWM modulators and overcurrent protection.
• The versatile structure of the analog input section with an error amplifier and a PWM comparator offer flexibility for implementing different types of PWM modulator schemes.

Infineon’s IRS2452A Class D Amplifier Control IC

MERUS^TM class D audio solutions

Jens Tybo Jensen, Head of Marketing & Application Engineering Class D Audio Products gives a brief overview of CES 2019, including new product offerings:
- Low power systems with best-in-class power efficiency and sound quality extending battery life
- High-power Gallium Nitride solutions

Cooler, smaller and lighter amplifiers for great sounding audio products

CES 2019: New products

CoolGaN^TM - the new power paradigm. Ultimate efficiency and reliability.

Gallium nitride (GaN) offers fundamental advantages over silicon. In particular the higher critical electrical field makes it very attractive for power semiconductor devices with outstanding specific dynamic on-state resistance and smaller capacitances compared to silicon switches, which makes GaN HEMTs great for high speed switching.

This is what Infineon’s CoolGaN™ e-mode HEMTs offer to you

Gallium Nitride (GaN)

Wireless charging

Imagine your smartphone’s battery is dead. Until now, you first must find the charging cable, then connect it to your phone and finally plug it into an outlet. The process works, but it can be a nuisance. Especially if your cable is playing hide and seek or if the jack doesn’t fit the cable. Wireless charging removes the hassle of re-fueling your devices. By using electromagnetic fields to transfer power from a transmitter to a receiver application, it charges your battery without a physical connection. All thanks to a wireless charging power supply.

Cut the cable for new charging experience

Low-side gate-driver ICs with truly differential inputs

Infineon's 1-channel low-side gate-driver family with truly differential inputs prevents false triggering of power MOSFETs.

Low-side gate-drivers

Infineon’s switching solutions for brushless DC (BLDC) motors – high voltage and low voltage switching solutions for BLDC.

Achieve the next level of efficiency.

Infineon's product portfolio for BLDC - High voltage and low voltage BLDC

CoolMOS™ G7 SJ MOSFET and CoolSiC™ Schottky diode G6 in Double DPAK (DDPAK)

CoolMOS™ G7 SJ MOSFET and CoolSiC™ Schottky diode G6 in Double DPAK (DDPAK) DDPAK is the very first SMD package with top-side cooling. A new way of cooling in high power SMPS applications. Thermal decoupling of PCB material and semiconductor enabling highest power density or improved system lifetime. www.infineon.com/DDPAK.

Double DPAK (DDPAK) package - Innovative top-side cooled SMD package

Webinar: LED lighting systems with smart thermal protection

How smart thermal protection provided by LED Driver ICs can help to extend lifetime of LED lighting systems.

• Efficiencies up to 98%
• Dimming level down to 1%
• Supported by user-friendly design tools

Infineon offers a broad portfolio of highly integrated DC-DC LED drivers that support currents from 150mA to 3A, making them the ideal choice for high- and ultra-high-power LEDs.

DC-DC LED Driver IC

Our expert tells you more on DC/DC Point-of-Load products benefits, applications and markets.

Infineon’s Integrated POL switching converters deliver benchmark efficiency and dramatically reduce system size. Solutions up to 35 A are available in compact PQFN packages. Target applications include server, storage, routers and switches, telecom base stations, digital home media, mobile computing and embedded data processing. Solutions with and without PMBus digital communication are available in single output and multi-rail format.

Future of Point of Load