This Ninth Edition Report includes presentations and discussions from many of the industry’s most influential members representing end-users, power supply manufacturers, component suppliers, consultants and academia. This roadmap report goal is to provide an outlook on technology trends in power conversion through the year 2019. The technology trend analysis and the roadmap is provided for the following specific product families expected to be the areas of largest market growth: Ac-dc front end power supplies; External ac-dc power supplies; Isolated dc-dc converters; and Non-isolated dc-dc converters. As was provided fin the 2013 report, a Flash Drive is included with this publication that includes all of the presentations that were an integral part of the information gathering process and include the PowerPoint charts together with the audio and the Q/A discussions.

This report is the Phase 2 report on 3D packaging of power sources and is a follow up to the previous report published by the PSMA Packaging Committee. The report begins with a discussion of PCB embedding technologies which are now in high volume production and together with 3D packaging technology predominately provide a significant performance and size reduction enhancement opportunity rather than a means to reduce costs. Also presented is information on high temperature die and component attachment technologies that are evolving rapidly in the research labs. However, high power-density component embedding and 3D packaging of power semiconductors also have to overcome a ‘thermal barrier” - since it is more challenging to remove heat generated within the body of a 3D integrated system than from a planar surface. To execute an embedded power design is very dependent on the availability of passive components optimized for PCB embedding and the report includes some of the available sources. The report also includes the results of a worldwide literature search of R&D published by participating organizations. These technologies, combined with wide-bandgap semiconductor devices will literally re-vitalize the entire power electronics infrastructure block by block, module by module, for the twenty-first century.

This report on 3D packaging of power sources is published by the PSMA Packaging Committee. The aim of the report is to review emerging 3D and other high density packaging trends and their possible application and impact on the electronic power conversion sector. The report posits that the challenge for the power packaging engineer is increasing. The well understood SMT device on PCB is now stretched to meet many emerging application requirements if current industry participants are to remain competitive. We believe a period of significant industry learning and investment in new packaging technologies is now required. The drivers for many of the required 3D packaging technologies have in many cases been in automotive and niche industrial areas, with the consumer electronics industry also being an area of significant innovation in packaging in recent years. Many of these technologies are now entering mainstream power conversion deployments.

This is a reprinted edition of one of the classic design texts on magnetics design! It is a complete, one-stop guide to transformer and inductor design and applications for everyone who designs, builds, or uses power magnetics components. Throughout this book, the author combines analysis and synthesis, and all theory is related to the solution of real-world problems. Sections of the text provide guidance in the use of transformers and inductors in power electronics and in digital and pulse circuits. Also included is design information about other forms of high-frequency magnetics such as transmission-line transformers, hybrid transformers, ferroresonant transformers, flyback converter magnetics and inductors used in switch mode power converter designs. Special attention is given in the book to the proper control of dielectric stress, corona and thermal factors in high-voltage magnetics designs. Modeling methods for magnetic parts are also included and treated in some detail. This book is an essential reference book for any engineer involved in the design and development of modern-day magnetic components.

This is the second in a series of classic magnetics texts offered to designers and students in the power electronics industry. The book was initially published in 1969 and was extensively revised by the author, E.C. Snelling, in 1988 to bring all eleven chapters in line with current design practices and applications of ferrite cores used in modern-day inductors and transformers. The aim of this unique 366-page reprint is to provide all the information on ferrite properties and wound-component design necessary for efficient applications of these materials. Data in the book are represented by means of extensive use of graphs and tables, and design procedures are supported by many working examples of inductors and transformers.

This book focuses on the fundamental behavior and characteristics of switchmode power converters and on the relative merits of many popular topologies. The first 11 chapters present the basic theory of switchmode power converter circuits with minimal use of mathematics. Chapter 12 focuses on converter circuits with integrated magnetics and concludes with an extensive bibliography and helpful lists of suggested reading materials for reference and research purposes.

This classic book, written by one of the most respected teachers in the field of magnetics, makes the principles of applied magnetics accessible to the practicing electronics engineer. With emphasis on practical design, the text presents the relevant principles of physics, circuit analysis, simple models and the calculations involved in designing a circuit or a magnetic device. Applications of magnetics, including those associated with power electronics circuits, are covered as well as reluctance modeling methods for transformers and inductors.

The publication has been completely revised and updated. In addition to definitions, there are eight appendices providing resource information on testing and standards agencies, world voltages and frequencies and EMI and MIL specs. There is also valuable information on writing technical publications and guides for units, symbols and style. A CD is included with this publication.

This is the third in a series of classic magnetics texts offered to designers and students in the power electronics industry. The book, authored by the late Rueben Lee and co-authored by Leo Wilson and Charles E. Carter was initially published by John Wiley and Sons in 1988, but has been out of print for several years. Lee’s classic book is considered by many magnetics design specialists as a thoroughly practical book in designing many types of magnetics devices and their applications, including power and pulse transformers and inductive components.

This document is intended as a guide for writers of specifications, catalogs, application notes and correspondence in power electronics. It is derived from the current international standard, ANSI/IEEE Std 260.1-1993, used by the electronics industry world- wide when writing in English. It is printing in a one page (two sides) format which is laminated and pre-punched for convenient filing in a notebook type binder. The Power Sources Manufacturers Association has prepared this guide in hope that it will lead to more uniform documentation and correspondence in the power electronics industry. Package of 10.